* Multiple-layer board manufacturing Capability * Precision SMT Capability * Complete ODM team * Complete Module Manufacturing Capability

Reducing the line width/spacing (L/S) through a semi-additive process significantly reduces the required space for internal assembly, thereby enabling product miniaturization. This process enables thinning and high-density FP coils, and is widely used in related fields such as OIS modules and thin-film inductor for smart phones.

Using fluorine materials with special processes to achieves extremely low DK & DF values, thereby achieving excellent low-loss characteristics during transmission. And in the current high-frequency and high-speed transmission solutions, relatively thin design is realized, making it widely applicable in 5G antenna modules, millimeter wave radar, and high-frequency and high-speed internal wiring operation. Can meet USB 3.1 or higher, PCIe Gen5, TBT 3 internal transmission requirements.

Satisfy durability in special environments while maintaining good peel strength to achieve product functional stability.